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| 1. product profile 1.1 general description array of 13 diodes and 11 resistors designed to protect downstream components against electrostatic discharge (esd) voltages as high as 15 kv. the device is encapsulated in a 1.56 mm ? 1.56 mm wafer-level chip-scale package (wlcsp) fabricated using monolithic silicon semiconductor technology. these features make the device ideal for use in applications requiring a high degree of miniaturization, such as mob ile phone handsets, cordless te lephones and personal digital devices. 1.2 features and benefits ? pb-free, restriction of hazardous substanc es (rohs) compliant and free of halogen and antimony (dark green compliant) ? integrated esd protection, electromagnetic interference (emi) and rf filtering for microsd memory card channels ? esd protection up to 15 kv on 6 channels at output terminals ? integrated emi and rf filters with pull-up resistors (on 5 channels) ? additional power supply protection ? wlcsp with 0.4 mm pitch 1.3 applications ? microsd memory card interfaces in ce llular phone and personal communication system (pcs) mobile handsets ? cordless telephones ? digital still and video cameras ? media players ? card readers IP4340CX15 6-channel filter for esd prote ction of microsd memory card interfaces rev. 2 ? 13 august 2012 product data sheet
IP4340CX15 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 13 august 2012 2 of 14 nxp semiconductors IP4340CX15 6-channel filter for esd protection of microsd memory card interfaces 2. pinning information 2.1 pinning 2.2 pin description [1] i = input, o = output, i/o = input and output, s = power supply. fig 1. pin configuration IP4340CX15 table 1. pin description symbol pin type [1] description data0 a1 i/o data 0 input or output data1 a2 i/o data 1 input or output sddata1 a3 i/o data 1 input or output on microsd card side sddata0 a4 i/o data 0 input or output on microsd card side clk b1 i/o clock signal input or output v cc b2 s supply voltage gnd b3 s ground sdclk b4 i/o clock signal on microsd card side cmd c1 i/o command signal n.c. c2 - - gnd c3 s ground sdcmd c4 i/o command signal on microsd card side data3 d1 i/o data 3 input or output data2 d2 i/o data 2 input or output sddata2 d3 i/o data 2 input or output on microsd card side sddata3 d4 i/o data 3 input or output on microsd card side IP4340CX15 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 13 august 2012 3 of 14 nxp semiconductors IP4340CX15 6-channel filter for esd protection of microsd memory card interfaces 3. ordering information 4. functional diagram 5. limiting values table 2. ordering information type number package name description version IP4340CX15/p wlcsp15 wafer-level chip-size package; 15 bumps; 1.56 ? 1.56 ? 0.47 mm IP4340CX15/p fig 2. schematic diagram IP4340CX15 ! " !" ! ! # ! $ ! %& ' table 3. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v i input voltage ? 0.5 +5.0 v v esd electrostatic discharge voltage iec 61000-4-2, level 4, pins on microsd card side [1] contact discharge [2] ? 15 +15 kv air discharge ? 15 +15 kv iec 61000-4-2, level 1, all other pins contact discharge ? 2+2kv air discharge ? 2+2kv p ch channel power dissipation continuous power; t amb =70 ? c-2 5m w p tot total power dissipation t amb =70 ?c - 100 mw IP4340CX15 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 13 august 2012 4 of 14 nxp semiconductors IP4340CX15 6-channel filter for esd protection of microsd memory card interfaces [1] pins microsd card side: a3, a4, b4, c4, d3, d4 and b2 [2] device is qualified with 1000 pulses of ? 15 kv contact discharges each, according to the iec 61000-4-2 model and far exceeds the specified level 4 (8 kv contact discharge). 6. characteristics [1] guaranteed by design. 7. frequency response t stg storage temperature ? 55 +150 ?c t reflow(peak) peak reflow temperature t p ? 10 s - 260 ?c t amb ambient temperature ? 30 +85 ?c table 3. limiting values ?continued in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit table 4. characteristics t amb =25 ? c unless otherwise specified. symbol parameter conditions min typ max unit r s(ch) channel series resistance r1 to r6 36 40 44 ? r pu pull-up resistance r9 to r12 40 50 60 k ? r13 121518k ? c line line capacitance including diode capacitance; v i =0v; f=1mhz; b2=gnd [1] 81114pf v br breakdown voltage i i =1ma 6 - - v i rm reverse leakage current v i = 3 v - - 100 na table 5. frequency response symbol parameter conditions min typ max unit ? il insertion loss all channels; r source =50 ? ; r l =50 ? f < 400 mhz - - 7 db 400 mhz < f < 800 mhz 4 - - db 800mhz IP4340CX15 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 13 august 2012 6 of 14 nxp semiconductors IP4340CX15 6-channel filter for esd protection of microsd memory card interfaces 8.2 crosstalk the setup for crosstalk measurements in a 50 ? nwa system from one channel to another is shown in figure 5 . for the measurements, calibrated rf-probes are contacted to dut bumps. typical examples of crosstalk measurement results are depicted in figure 6 and 7 . fig 5. crosstalk measurement configuration (1) pin a1 to b4 (2) pin a1 to a2, d1 to d2 (3) pin a1 to a3, d1 to d3 (1) pin a2 to b4 (2) pin a1 to c1 fig 6. crosstalk behavior between adjacent channels fig 7. crosstalk behavior between adjacent channels # . ' / 0 1023 4&23 # . 1025 4&25 ( ( (6# ($ (# ( (# ) *"+,- ! *- *- *- *- ( ( (6# ($ (# ( (# ) *"+,- ! *- *- *- IP4340CX15 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 13 august 2012 7 of 14 nxp semiconductors IP4340CX15 6-channel filter for esd protection of microsd memory card interfaces 9. package outline fig 8. package outline IP4340CX15 (wlcsp15) 7 89 ! "# 7 3 : 3 table 6. package outline dimensions symbol min typ max unit a 0.440.470.50mm a 1 0.18 0.20 0.22 mm a 2 0.26 0.27 0.28 mm b 0 . 2 10 . 2 60 . 3 1m m d 1 . 5 11 . 5 61 . 6 1m m e 1 . 5 11 . 5 61 . 6 1m m IP4340CX15 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 13 august 2012 8 of 14 nxp semiconductors IP4340CX15 6-channel filter for esd protection of microsd memory card interfaces 10. soldering of wlcsp packages 10.1 introduction to soldering wlcsp packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering wlcsp (wafer level chip-size packages) can be found in application note an10439 ?wafer level chip scale package? and in application note an10365 ?surface mount reflow soldering description? . wave soldering is not su itable for this package. all nxp wlcsp packages are lead-free. 10.2 board mounting board mounting of a wlcsp requires several steps: 1. solder paste printing on the pcb 2. component placement with a pick and place machine 3. the reflow soldering itself 10.3 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 9 ) than a pbsn process, thus reducing the process window ? solder paste printing issues, such as sm earing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature), and coo ling down. it is imper ative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 7 . e - 0.40 - mm e 1 -1 . 2-m m e 2 -1 . 2-m m table 6. package outline dimensions ?continued symbol min typ max unit table 7. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 IP4340CX15 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 13 august 2012 9 of 14 nxp semiconductors IP4340CX15 6-channel filter for esd protection of microsd memory card interfaces moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 9 . for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 10.3.1 stand off the stand off between the substrate and the chip is determined by: ? the amount of printed solder on the substrate ? the size of the solder land on the substrate ? the bump height on the chip the higher the stand off, the better the stresses are released due to tec (thermal expansion coefficient) differences between substrate and chip. 10.3.2 quality of solder joint a flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. the surface of the joint should be smooth and the shape symmetrical. the soldered joints on a chip should be uniform. voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. no failures have been found to be related to these voids. solder joint inspection after reflow can be done with x-ray to monitor defects such as bridging, open circuits and voids. msl: moisture sensitivity level fig 9. temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature IP4340CX15 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 13 august 2012 10 of 14 nxp semiconductors IP4340CX15 6-channel filter for esd protection of microsd memory card interfaces 10.3.3 rework in general, rework is not recommended. by rework we mean the process of removing the chip from the substrate and replacing it with a new chip. if a chip is removed from the substrate, most solder balls of the chip will be damaged. in that case it is recommended not to re-use the chip again. device removal can be done when the substrate is heated until it is certain that all solder joints are molten. the chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. removing the device must be done using plastic tweezers, because me tal tweezers can damage the silicon. the surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill remove d. when a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. apply flux on the bumps at the chip side as well as on the solder pads on the substrate. place and align the new chip while viewing with a microscope. to reflow the solder, use the solder profile shown in application note an10365 ?surface mount reflow soldering description? . 10.3.4 cleaning cleaning can be done after reflow soldering. IP4340CX15 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 13 august 2012 11 of 14 nxp semiconductors IP4340CX15 6-channel filter for esd protection of microsd memory card interfaces 11. revision history table 8. revision history document id release date data sheet status change notice supersedes IP4340CX15 v.2 20120813 product data sheet - IP4340CX15 v.1 modifications: ? corrected package dimensions in ta b l e 2 (height) and table 6 (maximum values d and e) IP4340CX15 v.1 20120615 product data sheet - - IP4340CX15 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 13 august 2012 12 of 14 nxp semiconductors IP4340CX15 6-channel filter for esd protection of microsd memory card interfaces 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 12.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 12.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification. IP4340CX15 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 13 august 2012 13 of 14 nxp semiconductors IP4340CX15 6-channel filter for esd protection of microsd memory card interfaces export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com nxp semiconductors IP4340CX15 6-channel filter for esd protection of microsd memory card interfaces ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 13 august 2012 document identifier: IP4340CX15 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 14. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 frequency response . . . . . . . . . . . . . . . . . . . . . 4 8 application information. . . . . . . . . . . . . . . . . . . 5 8.1 insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.2 crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 soldering of wlcsp packages. . . . . . . . . . . . . 8 10.1 introduction to soldering wlcsp packages . . . 8 10.2 board mounting . . . . . . . . . . . . . . . . . . . . . . . . 8 10.3 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . 8 10.3.1 stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 10.3.2 quality of solder joint . . . . . . . . . . . . . . . . . . . . 9 10.3.3 rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 10.3.4 cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 12 legal information. . . . . . . . . . . . . . . . . . . . . . . 12 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13 contact information. . . . . . . . . . . . . . . . . . . . . 13 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 |
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